Rework Pad Welding- Point Repair for Phones IC Pad Touch BGA- PCB Fingerprint

Description

Rework Pad Welding- Point Repair for Phones IC Pad Touch BGA- PCB Fingerprint
Features: Size: approx 2.8x2.8cm/1.1x1.1inches.
The pads are reinforced with fixed pins and will never fall off.
It adopts industrial-grade printed circuit board copper foil with a thickness of 30μm.
Good flatness,which can prevent pseudo soldering effectively caused by unevenness.
The connection joint with the circuit is firm ,and can fixed the green- oil(UV curing- solder mask ink)well.
Replace the tradional circling of jump wire to filled the missing solder joint ,restore to the original pad and without trace.
It saves time and effort and no need to circle during jumping wire so the repair efficiency is relatively high.
Specifications: Material: Copper
Size: approx 2.8x2.8cm/1.1x1.1in
Package Includes: 2x Soldering Lugs
note: Please allow 1-3cm error due to manual measurement. pls make sure you do not mind before you bid.
Due to the difference between different monitors, the picture may not reflect the actual color of the item.