7 Bottle 1.25W BGA Reballing Balls 0.25/0.3/0.35/0.4/0.45/0.5/0.6mm Solder Ball

Description

7 Bottle 1.25W BGA Reballing Balls 0.25/0.3/0.35/0.4/0.45/0.5/0.6mm Solder Ball
Description:
100% brand new and high quality
Feature:
Solder (Tin) paste is the best choice of reballing IC.
It is used instead of the pin in the IC component package structure.
Widely used in tinplate, flux, organic synthesis, chemical production, alloy manufacturing, and assembly of multiple integrated circuits in the electronics industry.
BGA Reballing Balls only, other accessories demo in the picture is not included!
Specifications:
Item Type: BGA Reballing Balls
Size: diameter: 0.25/0.3/0.35/0.4/0.45/0.5/0.6mm
Color: As shown
Quantity: 1.25w PCS per bottle
Balls Alloy: Sn63/Pb37
Quantity: 1 Set(7 Bottle)
Note:
Transition: 1cm=10mm=0.39inch
Please allow 0-1cm error due to manual measurement. pls make sure you do not mind before you bid.
Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!
Package Includes:
1Set x BGA Reballing Balls